PSA Oxygen Plant For Semiconductor Manufacturing

Oxygen purity: Semiconductor manufacturing usually requires ultra-high purity oxygen, generally required to reach 99.999% or even higher, to ensure the quality and performance of semiconductor products.
Oxygen flow rate: According to the production scale and process requirements of semiconductor manufacturing, PSA oxygen equipment needs to provide a stable oxygen flow rate to meet the continuous oxygen demand in the production process.
Dew point temperature: The moisture content in oxygen is required to be extremely low, and the dew point temperature is usually required to be below - 60℃ to prevent moisture from having an adverse effect on the semiconductor manufacturing process.
Particle impurity content: The content of particulate impurities in oxygen must be strictly controlled, generally required to be below 0.1 microns, to avoid particulate impurities causing defects on the surface of semiconductor chips.

Oxidation is a basic and critical step in many process links of semiconductor manufacturing. For example, in the oxidation process of silicon wafers, high-purity oxygen is required to form a silicon dioxide (SiO₂) layer. This silicon dioxide layer can be used as an insulating layer or as a mask for subsequent processes. The high-purity oxygen provided by PSA oxygen equipment (usually with a purity of up to 99.999% or even higher) can ensure the accuracy and stability of the oxidation reaction, so that the generated silicon dioxide layer has uniform quality and precise thickness, which is very important for the manufacture of high-performance semiconductor devices (such as transistors in integrated circuits).